| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation component having high thermal conductivity and excellent heat dissipation performance at low cost. Ž<P>SOLUTION: The heat dissipation component includes a substrate, a surface layer formed on both sides or one side of the substrate and comprising Zn or a Zn alloy as the primary component, and a ZnO whisker layer grown outward from the surface layer, wherein a melting point of the surface layer is lower than that of the substrate. The Zn alloy preferably contains at least one metal selected from among Cu, Bi, Sn, Cd and Ni. The substrate is made of a metal or an alloy and preferably has a thermal conductivity of 150 W/mK or above at 25°C. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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