| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition for microwave curing in which, when irradiated with microwaves in pulse form, the open circular structure of a polyamide efficiently causes dehydration at <250°C and the polyamide cyclizes, whereby a cured film can be obtained. <P>SOLUTION: The positive photosensitive resin composition for microwave curing contains at least (a) the polyamide soluble in an alkaline aqueous solution and having a repeating unit represented by formula (I) and (b) an o-quinonediazido compound. A pattern is produced using the positive photosensitive resin composition for microwave curing. In the formula, U denotes a tetravalent organic group; and V denotes a bivalent organic group. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
