发明名称 ELECTRONIC COMPONENT BONDING METHOD AND APPARATUS USING VIBRATION ENERGY
摘要 PURPOSE: By sanctioning the vibration energy to the traverse direction as to the electronic component bonding method and the vibration energy confirmation device, using the vibration energy the plane can prevent damage. CONSTITUTION: Provided is the resin for connection(3) among the first electronic component(1) and the second electronic component(2). The first electronic component and the second electronic component are each other arranged. The resin for connection becomes the fine scenery so that the elasticity generate in the resin for connection. The vibration energy is sanctioned in the resin for connection in which the elastic force generates and the first electronic component and the second electronic component are each other securely fixed.
申请公布号 KR20100093271(A) 申请公布日期 2010.08.25
申请号 KR20090012387 申请日期 2009.02.16
申请人 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 KIM, KYUNG SOO;JANG, TAE YOUNG;HA, CHANG WAN
分类号 H05K13/04 主分类号 H05K13/04
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