| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent sensitivity and resolution and sufficiently suppressing production of sludge, and to provide a photosensitive element, a method for forming a resist pattern and a method for manufacturing a printed wiring board by using the composition. <P>SOLUTION: The photosensitive resin composition contains (A) a binder polymer containing a copolymer prepared by polymerizing a plurality of kinds of monomers, (B) a photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator, and (D) an organic group-containing compound expressed by general formula (1), wherein the plurality of kinds of monomers include (a) (meth)acrylic acid, (b) methyl methacrylate or ethyl methacrylate, and (c) an alkyl acrylate having 4 or more carbon atoms in an alkyl group. <P>COPYRIGHT: (C)2007,JPO&INPIT |
