Adhesive composition of low molecular weight poly-aminopolyamide-ephichlorohydrin (PAE) resin and protein

摘要

The invention is directed to compositions containing polyamidoamine-epihalohydrin resins (PAE resins) of low molecular weight and a soy protein or lignin in which the weight ratio of protein or lignin to PAE is 100:0.1 to 0.1:100. The invention is also directed to the use of the compositions as adhesives for binding wood materials. The lower adhesive viscosity provides better handling properties, as well as allowing for less water in the adhesive formulation. The lower viscosity provides for both ease of handling of the adhesive material and the pot life if the adhesive formulation