发明名称 ELECTRONIC DEVICE FORMED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, ELECTRONIC APPLICATION BY USING THE SAME
摘要 PURPOSE: It interlinks the cable as the fixed clamp to substrate and the electronic device for being molded and shaped, and the manufacturing method thereof, the making mold and the applied electronic device mold the whole. In that way the bending of the cable, and the durability about the push-pull can be improved. CONSTITUTION: In the substrate(20), the circuit component is mounted. The cable(30) transfers the external signal to substrate. Clamp fixes the cable on substrate. It into one body molds substrate and clamp to the resinous material and the casing molding unit(12) forms the overall look. By being mounted in substrate and pressing, it offers signal and the driving part GBN. The driving part is molded with the casing molding unit and the driving part mold casing part into one body molded and shaped.
申请公布号 KR20100093290(A) 申请公布日期 2010.08.25
申请号 KR20090012410 申请日期 2009.02.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, DUK WOO;SUNG, JAE SUK;LEE, DAE KYU;YANG, TAE SEOK;JEON, YOUNG HO
分类号 H05K5/00;G11B20/00 主分类号 H05K5/00
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