Chip Attach Adhesive To Facilitate Embedded Chip Build Up And Related Systems And Methods

摘要

Present embodiments are directed to an adhesive (106) and method for assembling a chip package (100). The adhesive (106) may be used to couple a chip (108) to a substrate (102), and the adhesive (106) may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator.