| 摘要 |
PURPOSE: A semiconductor light emitting device and a manufacturing method thereof are provided to minimize warpage or break of a wafer in a laser scribing or braking by inserting a metal layer into an insulation layer on the outer side of a light emitting structure. CONSTITUTION: A light emitting structure(110) comprises a plurality of compound semiconductor layers. A second electrode layer(130) is formed under the light emitting structure. An isolation layer(121) is formed along the outer boundary between the light emitting structure and the second electrode. A metal layer(123) is formed along the outer side of the isolation layer. An insulation layer(125) is formed on the outer side of the light emitting structure. The insulation layer seals the outer side of the metal layer. |
