发明名称 |
Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor |
摘要 |
A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl methacrylate, methacrylic acid, and hydroxyethyl methacrylate; about 1 to 7 percent by weight of a cross-linking agent; about 0.01 to 0.5 percent by weight of a thermal acid generator; about 0.01 to 1 percent by weight of a photoacid generator; about 0.00001 to 0.001 percent by weight of an organic base; and a solvent.
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申请公布号 |
US7781153(B2) |
申请公布日期 |
2010.08.24 |
申请号 |
US20070730323 |
申请日期 |
2007.03.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG KYONG-RIM;AHN SUN-YUL;KIM YOUNG-HO;KIM JAE-HYUN;YANG JOO-HYUNG;KIM TAE-SUNG |
分类号 |
G03F7/30 |
主分类号 |
G03F7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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