发明名称 Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor
摘要 A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl methacrylate, methacrylic acid, and hydroxyethyl methacrylate; about 1 to 7 percent by weight of a cross-linking agent; about 0.01 to 0.5 percent by weight of a thermal acid generator; about 0.01 to 1 percent by weight of a photoacid generator; about 0.00001 to 0.001 percent by weight of an organic base; and a solvent.
申请公布号 US7781153(B2) 申请公布日期 2010.08.24
申请号 US20070730323 申请日期 2007.03.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG KYONG-RIM;AHN SUN-YUL;KIM YOUNG-HO;KIM JAE-HYUN;YANG JOO-HYUNG;KIM TAE-SUNG
分类号 G03F7/30 主分类号 G03F7/30
代理机构 代理人
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