发明名称 Resin sheet for encapsulating optical semiconductor element and optical semiconductor device
摘要 The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.
申请公布号 US7781794(B2) 申请公布日期 2010.08.24
申请号 US20090409782 申请日期 2009.03.24
申请人 NITTO DENKO CORPORATION 发明人 SUEHIRO ICHIRO;AKAZAWA KOUJI;USUI HIDEYUKI
分类号 H01L33/00;H01L23/29;H01L23/31;H01L33/48;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/00
代理机构 代理人
主权项
地址