发明名称 |
Light emitting device package having a transparent cover |
摘要 |
A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device. |
申请公布号 |
US7781788(B2) |
申请公布日期 |
2010.08.24 |
申请号 |
US20060495764 |
申请日期 |
2006.07.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
DARBINIAN ARTHUR;CHOI SEUNG TAE;KWON KI HWAN;MOON CHANG YOUL;SHIN KYU HO |
分类号 |
H01L33/00;H01L33/48;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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