发明名称 Heat dissipation module
摘要 An electronic device includes a first electronic component, a second electronic component adjacent to the first electronic component, a heat sink arranged on the first electronic component to absorb heat therefrom, an axial fan mounted on the heat sink for generating an airflow to the heat sink, and a guiding member. The axial fan includes a frame and an impeller received in the frame. A cutout is defined in the frame facing the second electronic component. The guiding member is arranged between the axial fan and the second electronic component for guiding a part of the airflow escaping from the frame via the cutout to the second electronic component.
申请公布号 US7782614(B2) 申请公布日期 2010.08.24
申请号 US20090476243 申请日期 2009.06.01
申请人 FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 LI SHU-MIN;ZHA XIN-XIANG
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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