发明名称 Heat dissipation device with heat pipes
摘要 A heat dissipation device for dissipating heat from a heat-generating device includes a heat-absorbing plate, a heat pipe assembly attached to the heat-absorbing plate and a fin set attached to the heat pipe assembly. The fin set includes a plurality of fins and has a contacting surface cooperatively formed by bottom edges of the fins and attached to the heat pipe assembly. The heat pipe assembly includes heat pipes with evaporating sections and condensing sections located away from the evaporating sections. The evaporating sections of the heat pipes are covered by the heat-absorbing plate and the condensing sections of the heat pipes are exposed outside of the heat-absorbing plate. The heat pipes absorb heat from the heat-generating device via the heat-absorbing plate, and directly transfer the heat to the fin set.
申请公布号 US7779897(B2) 申请公布日期 2010.08.24
申请号 US20070772810 申请日期 2007.07.02
申请人 FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY, CO., LTD. 发明人 JIN ZHAO;FU MENG;CHEN CHUN-CHI
分类号 F28D15/00;F28F7/00;H05K7/20 主分类号 F28D15/00
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