发明名称 Shielded via
摘要 A system may include a first conductive ground pad, a second conductive ground pad, a first conductive via coupling the first ground pad to the second ground pad, a first conductive signal trace, a second conductive signal trace, and a second conductive via disposed within the first conductive via and coupling the first conductive signal trace to the second conductive signal trace. The first conductive ground pad and the second conductive ground pad may be disposed between the first conductive signal trace and the second conductive signal trace.
申请公布号 US7781889(B2) 申请公布日期 2010.08.24
申请号 US20060477703 申请日期 2006.06.29
申请人 INTEL CORPORATION 发明人 LEADER BRAM;DOERSCH RICHARD R.
分类号 H01L23/48;H01L23/535;H05K3/42 主分类号 H01L23/48
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