发明名称 |
Techniques for packaging multiple device components |
摘要 |
Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dices coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
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申请公布号 |
US7781875(B2) |
申请公布日期 |
2010.08.24 |
申请号 |
US20070708196 |
申请日期 |
2007.02.20 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BOLKEN TODD O.;COBBLEY CHAD A. |
分类号 |
H01L21/00;H01L23/31;H01L23/538;H01L25/065;H01L25/10 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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