发明名称 Method for manufacturing substrate for semiconductor light emitting element and semiconductor light emitting element using the same
摘要 A semiconductor light emitting element having a semiconductor light emitting structure on a first main surface of a substrate, wherein the first main surface of the substrate has a substrate protrusion portion thereon, wherein a bottom surface of a protrusion is wider than a top surface thereof in a cross section of the substrate and the top surface is included in the bottom surface in a top view of the substrate, the bottom surface has an approximately polygonal shape which has a convex portion on each constituent side of the bottom surface, and the top surface has an approximately circular shape.
申请公布号 US7781790(B2) 申请公布日期 2010.08.24
申请号 US20070004079 申请日期 2007.12.20
申请人 NICHIA CORPORATION 发明人 MINATO SHUNSUKE;NARITA JUNYA;WAKAI YOHEI;NARUKAWA YUKIO;YAMADA MOTOKAZU
分类号 H01L33/00;H01L33/22;H01L33/32;H01L33/60;H01L33/62 主分类号 H01L33/00
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