发明名称 Structure for reduction of soft error rates in integrated circuits
摘要 A structure for reduction of soft error rates in integrated circuits. The structure including: a semiconductor substrate; and a stack of one or more wiring levels stacked from a lowermost wiring level to an uppermost wiring level, the lowermost wiring level nearer the semiconductor substrate than the uppermost wiring level; and an alpha particle blocking layer on a top surface of the uppermost wiring level of the one or more wiring levels, the blocking layer comprising metal wires and a dielectric material, the blocking layer having a combination of a thickness of the blocking layer and a volume percent of metal wires in the blocking layer sufficient to stop a predetermined percentage of alpha particles of a selected energy or less striking the blocking layer from penetrating into the stack of one or more wiring levels or the substrate.
申请公布号 US7781871(B2) 申请公布日期 2010.08.24
申请号 US20090483364 申请日期 2009.06.12
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CABRAL, JR. CYRIL;GORDON MICHAEL S.;RODBELL KENNETH P.
分类号 H01L23/552 主分类号 H01L23/552
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