发明名称 High thermal conductivity materials with grafted surface functional groups
摘要 The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materials 30 and a host resin matrix 32. The HTC materials 30 form a continuous organic-inorganic composite with the host resin matrix 32 via surface functional groups that are grafted to the HTC materials 30 and form covalent linkages with the host resin matrix 32. Phonons 34 tend to pass along the HTC materials 30 as they travel through the host resin matrix 32, and phonons 36 pass to the next HTC material if the distance between these materials is less than n.
申请公布号 US7781063(B2) 申请公布日期 2010.08.24
申请号 US20050152986 申请日期 2005.06.14
申请人 SIEMENS ENERGY, INC. 发明人 SMITH JAMES DAVID BLACKHALL;STEVENS GARY;WOOD JOHN WILLIAM
分类号 B32B27/38;B32B27/04;B32B27/20;C08K3/00;C08K3/14;C08K3/22;C08K3/28;C08K7/00;C08K9/04;C08L63/00 主分类号 B32B27/38
代理机构 代理人
主权项
地址