| 摘要 |
PURPOSE: The structure of discharge heat integrated optical device package module and manufacturing method thereof integratedly form the cooling fin on substrate. The heat created in the optical device is emitted effectively. CONSTITUTION: The metallic board(10) is formed into the sheet form. The optical device(30) is mounted in one side of the metallic board. The heat-sinking member(20) is into one body formed according to the edge of the opposite surface in which the optical device of the metallic board is mounted. A plurality of cooling pins(22) is formed in the outer side of the heat-sinking member into multi-stage. The heat radiation fan(80) is formed in the optical device opposing side of the metallic board.
|
