| 摘要 |
PURPOSE: A plating apparatus for substrates is provided to minimize the installation area and enable continuous plating by arranging plating baths to overlap each other. CONSTITUTION: A plating apparatus for substrates comprises a plating chamber, a loading unit(110), an unloading unit(120), a substrate transfer unit(150). The plating chamber comprises a plurality of plating baths(160) to plate a plurality of substrates at the same time. The loading unit receives substrates to be plated, and the unloading unit receives plating-completed substrates. The substrate transfer device carries substrates between the loading unit, the unloading unit, and the plating chamber. |
