发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>PURPOSE: The number of substrate processing apparatus and method for treating substrates is the vacuum drying units is reduced. The increase of the cost about the apparatus and footprint are controlled. CONSTITUTION: Supplies the coating solutions to the hunt master shift(1) is the processed surface of substrate. The drying method(2) enforces the predetermined drying treatment for the coating film formed in the top of the substrate. The reforming water shift(4) reforms the surface layer of the coating film in which the drying treatment is enforced with the drying method. The edge remover(3) eliminates the spare of the plate circumference edge part resist film.</p>
申请公布号 KR20100092875(A) 申请公布日期 2010.08.23
申请号 KR20100006811 申请日期 2010.01.26
申请人 TOKYO ELECTRON LIMITED 发明人 TAKEKUMA TAKASHI;ASOU YUTAKA
分类号 H01L21/027;G02F1/13;G03F7/38 主分类号 H01L21/027
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