发明名称 EECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: An electronic device and a method of manufacturing thereof are provided to prevent the inflow of foreign materials by forming a sealing and a sealing ring to be a closed loop. CONSTITUTION: An electronic device(100) includes a passivation layer(122) and a polymer layer(124) to protect a device layer. A substrate assembly(200) is opposite to the electronic device. A sealing ring(400) is arranged between the electronic device and the substrate assembly and has a closed loop surrounding a sealing region. The sealing ring has at least one side which is contacted with the polymer layer and is formed on the passivation layer.
申请公布号 KR100976813(B1) 申请公布日期 2010.08.20
申请号 KR20100037978 申请日期 2010.04.23
申请人 OPTOPAC CO., LTD. 发明人 CHO, YOUNG SANG
分类号 H01L23/31;H01L27/14 主分类号 H01L23/31
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