| 摘要 |
PROBLEM TO BE SOLVED: To prevent warpage of a board even when a protective layer functioning as a solder resist is formed on a surface layer of the board in a printed board wherein a surface layer formed of an insulation layer made of a resin and connection to the surface layer is performed by soldering, wire bonding, or conductive adhesive. SOLUTION: A printed board 100 includes a board portion 10 having a surface layer 12 formed of an insulation material made of a resin, wherein surface layer wiring 21 and lands 20 for external connection are provided on the outer surface of the surface layer 12. A protective layer 30 having openings 31 for covering the surface layer wiring 21 to protect the surface layer wiring 21 and exposing the lands 20 is formed on the outer surface of the surface layer 12, wherein the protective layer 30 is made of the insulation material forming the surface layer 12. COPYRIGHT: (C)2010,JPO&INPIT
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