发明名称 PLASMA PROCESSING APPARATUS, AND ELECTRODE MEMBER FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus of which the component consumption cost is reduced by extending the life of an electrode member configuring a lower electrode and the inside of which is prevented from being contaminated due to attachment of scattered objects, and to provide the electrode member to be used for the plasma processing apparatus. SOLUTION: In the plasma processing apparatus for applying plasma processing to a plate-like workpiece, the electrode member 46 abutted on the lower surface of the workpiece is configured by brazing a plate-like adsorption member 45 in which a plurality of through holes 45a are formed and a cooling plate 44, a thermal-sprayed film 65 obtained by thermal-spraying alumina is formed on the upper surface of the adsorption member 45, and an edge of a hole portion 45d on which the through hole 45a is opened is covered with the thermal-sprayed film 65. Consequently, the consumption of the electrode member due to sputtering is reduced to extend the life of the electrode member and to reduce component consumption cost and the inside of the apparatus can be prevented from being contaminated with scattered objects. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010183090(A) 申请公布日期 2010.08.19
申请号 JP20100054000 申请日期 2010.03.11
申请人 PANASONIC CORP 发明人 IWAI TETSUHIRO
分类号 H01L21/3065;H01L21/205;H01L21/683 主分类号 H01L21/3065
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