| 摘要 |
PROBLEM TO BE SOLVED: To increase throughput of substrate processing by efficiently carrying substrates. SOLUTION: In an application development processing system 1, first to fourth buffer devices 41-44 and first to fourth processor groups G1-G4 are disposed around a wafer carrier 40. Each of the first to fourth buffer devices 41-44 has a buffer portion for vertically storing a plurality of wafers in multiple stages. The first to fourth buffer devices 41-44 can be moved on a rail 45 by a buffer portion carrying mechanism to positions opposed the first to fourth processor groups G1-G4. Each processor in the first to fourth processor groups G1-G4 includes a wafer carrying mechanism for carrying the wafer between the processor and the first to fourth buffer devices 41-44. COPYRIGHT: (C)2010,JPO&INPIT |
