| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance accuracy of reading alignment mark position. Ž<P>SOLUTION: The present invention relates to an alignment mark and a forming method thereof, wherein a plating electricity feeding film 13 is formed on a surface of a substrate 12, and a photoresist pattern is formed on the plating electricity feeding film 13 and then patterned by electric plating. The alignment mark has a plating electricity feeding film non-formation region 16 which controls the film thickness of a plating layer to become a mark body 15 by adjusting resistance in plating electricity feeding by partially providing a region which is provided at a periphery of the mark body 15 and where the plating feeding film 13 is not formed. The forming method of the alignment mark includes controlling the film thickness of the plating layer to become mark body 15 by adjusting the resistance in the plating electricity feeding by partially providing the region where the plating electricity feeding film 13 is not formed by forming the plating electricity feeding film non-formation region 16 at the periphery of the mark body 15. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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