| 摘要 |
A process of producing a polyimide film including applying a polyamic acid solution composition to a substrate to form a coating layer and heating the coating layer, wherein the polyamic acid solution composition contains a mixed solvent system of at least two solvents selected from N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, and 1,3-dimethyl-2-imidazolidinone, each solvent being present in a proportion ranging from 7% to 93% based on the total mixed solvent system, and a polyamic acid composed mainly of s-BPDA and PPD. The process enables a film with a thickness exceeding 40 μm to be formed without involving bubble formation.
|
