发明名称 ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME
摘要 An electronic device manufactured by molding according to an aspect of the invention may include a driving unit supplying a signal upon being pressed and then returning to its original state; a board having the driving unit mounted thereon; a driving unit mold casing unit molded with the driving unit from a resin material such that the driving unit can be driven; and a casing molding unit molded to completely cover the board, together with the driving unit mold casing unit, to form the outer appearance.
申请公布号 US2010208933(A1) 申请公布日期 2010.08.19
申请号 US20090629716 申请日期 2009.12.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE DUK WOO;SUNG JAE SUK;LEE DAE KYU;YANG TAE SOOK;JEON YOUNG HO
分类号 H04R1/02;B29B13/02;B29C45/14 主分类号 H04R1/02
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