发明名称 |
ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME |
摘要 |
An electronic device manufactured by molding according to an aspect of the invention may include a driving unit supplying a signal upon being pressed and then returning to its original state; a board having the driving unit mounted thereon; a driving unit mold casing unit molded with the driving unit from a resin material such that the driving unit can be driven; and a casing molding unit molded to completely cover the board, together with the driving unit mold casing unit, to form the outer appearance.
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申请公布号 |
US2010208933(A1) |
申请公布日期 |
2010.08.19 |
申请号 |
US20090629716 |
申请日期 |
2009.12.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE DUK WOO;SUNG JAE SUK;LEE DAE KYU;YANG TAE SOOK;JEON YOUNG HO |
分类号 |
H04R1/02;B29B13/02;B29C45/14 |
主分类号 |
H04R1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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