<p>The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.</p>
申请公布号
WO2010093342(A1)
申请公布日期
2010.08.19
申请号
WO2008US80935
申请日期
2009.02.12
申请人
INNOPAD, INC.;HSU, OSCAR, K.;LEFEVRE, PAUL;WELLS, DAVID ADAM;JIN, MARC;ALDEBORGH, JOHN, ERIK
发明人
HSU, OSCAR, K.;LEFEVRE, PAUL;WELLS, DAVID ADAM;JIN, MARC;ALDEBORGH, JOHN, ERIK