| 摘要 |
<p>A component having a multilayer solderable or bondable connecting surface on a substrate is proposed, which, in addition to the electrically conductive pad metallization and the UBM metallization also has an electrically conductive stress compensation layer that is arranged between the substrate and the pad metallization or between the pad metallization and the UBM metallization. The insensitivity to stress of the connecting metallization is achieved by means of a stress compensation layer whose modulus of elasticity is less than that of the UBM metallization.</p> |
