发明名称 HEAT-EXPANDABLE MICROCAPSULE AND ADHESIVE SHEET
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat-expandable microcapsule having a sufficient amount of gas blowout, and to provide an adhesive sheet using the same. Ž<P>SOLUTION: The heat-expandable microcapsule is prepared by polymerization of a vinyl monomer including at least a nitrile monomer component of 50-80 wt.% and a non-nitrile monomer component of 50 wt.% or less, and includes a shell polymer including an azo compound encapsulating a volatile expanding agent gaseous at a temperature equal to or lower than the softening point of the shell polymer, and the content of a (meth)acrylic acid ester contained in the vinyl monomer is 20-50 wt.%. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010180415(A) 申请公布日期 2010.08.19
申请号 JP20100096858 申请日期 2010.04.20
申请人 SEKISUI CHEM CO LTD 发明人 KAWAGUCHI YASUHIRO;HATAI MUNEHIRO;FUKUOKA MASATERU;HAYASHI SATOSHI;DANJO SHIGERU;OYAMA YASUHIKO
分类号 C09K3/00;C09J7/02;C09J11/08;C09J201/00 主分类号 C09K3/00
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