| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silica structure and a method for manufacturing the structure having all of high strength, low bulk density and low thermal conductivity, and to provide a heat insulator using the silica structure. Ž<P>SOLUTION: The silica structure comprises spherical mesoporous silica and coupling portions comprising a metal oxide and coupling the spherical mesoporous particles. A low heat-conducting material is provided by using the silica structure. The silica structure is obtained by mixing spherical mesoporous silica having pores packed with a masking substance and a liquid containing a reactive binder, molding the obtained mixture, allowing the reactive binder to react to form coupling portions among the spherical mesoporous silica particles, and removing the masking substance from the pores. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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