| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a structure for mounting an IC chip onto a wiring substrate that can control surplus paste from flowing into a region where an adhesive agent should not be applied without increasing the chip area. <P>SOLUTION: In the mounting structure wherein an image sensor chip 20 is mounted on a glass substrate 10, an affinity region 30 having a comparatively high affinity with an ACP 40 is formed in a region outside a place joining with a bump 24 of all the regions on the glass substrate 10. The affinity region 30 is formed by providing island-shaped patternings at the highest layer of the insulating layers laminated on the glass substrate 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
