Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers

摘要

The invention relates to a carrier for holding semiconductor wafers during a double-side polishing of the semiconductor wafers, comprising cutouts for receiving the semiconductor wafers and passage openings for a polishing agent supplied during the polishing. Some of the passage openings are formed by holes which have a diameter of 2 to 8 mm and are arranged at a distance of 1 to 10 mm around the cutouts, wherein the holes are arranged on two central sections and an inner or an outer section of a circular path.