| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a rack cooling system and method that are inexpensive, and can support, particularly, a group of high-power racks and/or enclosures, or to overcome local thermal problems in equipment room or data center. <P>SOLUTION: A first portion of housings is configured to hold heat-producing electronic equipment and a second portion of the housing is configured to hold at least one cooling unit. Each of the housings of the first portion is configured to hold the electronic equipment such that gas is drawn into the equipment from fronts of the equipment, heated by the equipment to become heated gas, and expelled through the backs of the housings. The housings and at least one panel are disposed and coupled for laterally enclosing a hot region and defining a top opening allowing gas to vertically exit the hot region, and the backs of the housings of the first portion are disposed adjacent to the hot region such that the heated gas is expelled into the hot region. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
