SEMICONDUCTOR PACKAGE STRUCTURE

摘要

A semiconductor package structure is disclosed. The semiconductor package structure includes semiconductor chips on a semiconductor substrate. Each of the semiconductor chips includes chip pads. Through-vias extend through each of the semiconductor chips. Redistribution structures and a chip selection interconnection line are disposed on each of the semiconductor chips. The redistribution structures electrically connect at least one of the through-vias with at least one of the chip pads. Each chip selection interconnection line includes first regions connected to a corresponding number of the through-vias and a second region connecting at least one of the first regions with one of the chip pads. The semiconductor chips are stacked and electrically connected using the through-vias.