RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE

摘要

Disclosed are: a composite body comprising fine wiring lines and via holes which are formed in a resin layer of the composite body and have high adhesion, high reliability and suitability for high frequencies; a method for producing a composite body; and a semiconductor device. Also discloses are a resin composition and a resin sheet, each is capable of providing the composite body. Specifically disclosed is a composite body comprising a resin layer and a conductor layer, which is characterized in that: a groove having a maximum width of not less than 1 µm but not more than 10 µm is formed in the surface of the resin layer, a conductor layer is provided within the groove, and the resin layer surface in contact with the conductor layer has an arithmetic average roughness (Ra) of not less than 0.05 µm but not more than 0.45 µm; and/or in that a via hole having a diameter of not less than 1 µm but not more than 25 µm is formed in the resin layer, a conductor layer is provided within the via hole, and the resin layer surface within the via hole has an arithmetic average roughness (Ra) of not less than 0.05 µm but not more than 0.45 µm. Also specifically disclosed are: a resin composition containing an inorganic filler and a thermosetting resin, which is characterized in that the inorganic filler contains coarse grains having a size of 2 µm or more in an amount of 500 ppm or less; and a resin sheet in which a resin layer formed from the resin composition is formed on a base.