| 摘要 |
<P>PROBLEM TO BE SOLVED: To rationalize the solder residual quantity of a solder pool used for solder printing without generating the limitation of a substrate size and a tact loss. <P>SOLUTION: In switching to backward printing from forward printing, while a squeegee 702 is positioned in the movement direction of just before the switching to a solder pool SP, that is, the downstream side in the backward direction, and the squeegee 702 is positioned at the opposite side (front side) of the orifice of a mask 51, the solder pool SP is detected. Therefore, even if the solder adhered to the squeegee 702 drips off during measuring the amount of solder, since the adhering position of solder is at an anti-orifice DM 2 of the mask 51, the constraint that the registration of the mask 51 and a substrate 1 or the like becomes unnecessary. Moreover, without moving the solder pool SP by the anti-orifice DM 2, the detection of the solder pool SP is performed only by switching the position of the squeegee 702 to the solder pool SP. <P>COPYRIGHT: (C)2010,JPO&INPIT |
