发明名称 POSITIVE RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, AND POLYMER COMPOUND
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition having excellent resolution and for forming a resist pattern having a satisfactory shape, a resist pattern forming method and a polymer compound. <P>SOLUTION: The positive resist composition contains a base material component (A) whose solubility in an alkali developing liquid is increased by an action of acid and an acid generating agent component (B) generating acid by light exposure, wherein the base material component (A) contains a resin component (A1) having a constituent unit (a0) including a group represented by general formula (a0-0-1) [in formula, R<SP>1</SP>and R<SP>2</SP>each independently represents a hydrogen atom or a 1-5C lower alkyl group, Y<SP>1</SP>represents a 2-15C alkylene group which may have an ether bond and X represents a 1-20C hydrocarbon group]. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010181857(A) 申请公布日期 2010.08.19
申请号 JP20090185960 申请日期 2009.08.10
申请人 TOKYO OHKA KOGYO CO LTD 发明人 KOMURO YOSHITAKA;UTSUMI YOSHIYUKI;IRIE MAKIKO
分类号 G03F7/039;C08F6/00;G03F7/004;H01L21/027 主分类号 G03F7/039
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