发明名称 METHOD OF FORMING METAL WIRING AND METAL WIRING FORMED USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of forming metal wiring; and metal wiring formed using the same. <P>SOLUTION: This method of forming metal wiring includes steps of: printing wiring using an ink composition including metallic nanoparticles and a dispersant for maintaining the metallic nanoparticles in a dispersed state; primary firing of firing the wiring in a vacuum or inactive atmosphere to suppress particle growth; and second firing of firing the wiring by releasing the vacuum or inactive atmosphere to accelerate particle growth. The method of forming metal wiring induces abnormal particle growth by rapidly removing dispersant for inducing the growth of metallic nanoparticles, at a temperature at which the growth drive force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Thereby, the metal wiring includes a dense structure large in an average particle diameter of the particles, and excels in the electrical and mechanical characteristics. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010183053(A) 申请公布日期 2010.08.19
申请号 JP20090160057 申请日期 2009.07.06
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 SONG YOUNG-AH;JOO YOUNG CHANG;LEE JI HOON;YI SEOL MIN;TEI ZAIYU;OH SUNG IL;KIM TAE HOON;KIM IN-YOUNG
分类号 H05K3/12;H05K3/10 主分类号 H05K3/12
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