| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board that is made with a simple process of interlayer connection by electric resistance welding that requires no interlayer connection structure, and to provide the method of manufacturing the same. <P>SOLUTION: The printed circuit board includes: an insulation layer 122; and circuit layers 116a and 116b having land members 118a and 118b, and a patterned members 120a and 120b formed on both surfaces of the insulation layer 122. The land members 118a and 118b formed on both surfaces of the insulation layer 122 are mutually joined by the electric resistance welding. Circuit layers 116a and 116b formed on both surfaces of the insulation layer 122 are interlayer-connected by the electric resistance welding. Accordingly, no extra interlayer connection structure such as vias or bumps and no process for forming the same are needed, and the structure and process are simplified. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
