| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for mounting a composite circuit of a high-voltage circuit and a low-voltage circuit which is useful for simultaneously suppressing an increase in a footprint and preventing the occurrence of short circuits. SOLUTION: Each component of a main IC chip 52 and a backup circuit 53, which are part of a high-voltage circuit, are mounted on a sub-substrate 51, coated with a moisture-proof agent 58, and formed into a hybrid IC 5. This reduces a pitch between terminals of the main IC chip 52 and the backup circuit 53 as well as usage of the moisture-proof agent 58. This also eliminates a space where the main IC chip 52 and the backup circuit 53 are mounted, and terminals 36, 37 for connecting the hybrid IC are provided on a high-voltage circuit mounting area 3a of a main substrate 3, where a high-voltage total voltage processing circuit 33 and a high-voltage side control circuit 34, the rest of the high-voltage circuit, are mounted, to have a longer insulation distance than an insulation distance between the terminals of the main IC chip 52 and backup circuit 53. Then, the hybrid IC 5 is disposed overlapping top of the high voltage circuit mounting area 3a of the main substrate 3. COPYRIGHT: (C)2010,JPO&INPIT |
