| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP device preventing dropping on a polishing pad of dried and solidified slurry causing scratching of a polishing object. <P>SOLUTION: The CMP device has a circumferentially rotatable platen 3 disposed in a waste fluid tank 2 and having a predetermined thickness, the polishing pad 4 stuck to the platen 3, a carrier 6 freely pressing the polishing object 5 against the polishing pad 4, and a slurry feeding device freely dripping slurry on the polishing pad 4. The inner side of a sidewall 2c of the waste fluid tank 2 positioned in an outer side of a circumferential part of the platen 3 is curved to swell outward. <P>COPYRIGHT: (C)2010,JPO&INPIT |
