| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid jet head that can easily position and bond a plurality of members with high accuracy, and to provide the liquid jet head and a liquid jetting apparatus. Ž<P>SOLUTION: The method of manufacturing the liquid jet head includes processes for: forming adhesion positioning holes 501A, 501B in a passage forming substrate wafer 110 and a protective substrate wafer 130 respectively; and providing at least one adhesive surface of the passage forming substrate wafer 110 and protective substrate wafer 130 with an adhesive layer, inserting an adhesion positioning pin 511 smaller in diameter than the adhesion positioning holes, pressing the passage forming substrate wafer 110, the protective substrate wafer 130 and the adhesion positioning pin 511 to allow the adhesion positioning pin 511 to abut on the inner wall surface of the adhesion positioning hole to thereby fix the relative positions of the passage forming substrate wafer 110 and protective substrate wafer 130, and in this state, hardening the adhesive layer to bond the passage forming substrate wafer 110 and the protective substrate wafer 130. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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