A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a "PowerDie"). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.
申请公布号
WO2010074842(A3)
申请公布日期
2010.08.19
申请号
WO2009US64748
申请日期
2009.11.17
申请人
INTERSIL AMERICAS INC.;BELL, DAVID B.;HEBERT, FRANCOIS;KELKAR, NIKHIL