| 摘要 |
<P>PROBLEM TO BE SOLVED: To attain inexpensive mounting of an IC (Integrated Circuit) chip onto a wiring substrate in case of mixed presence of a region including an adhered part having a complicated form of the IC chip to the wiring substrate and a region with terminals disposed at narrow pitches. <P>SOLUTION: In a mounting structure in which the IC chip 20 is mounted onto the wiring substrate 10, in the region where relatively small-sized bumps 22b are disposed at relatively narrow pitches, the IC chip 20 is adhered to the wiring substrate 10 with an ACF (Anisotropic Conductive Film) 3 and in the region where the adhered part of the IC chip 20 to the wiring substrate 10 has a form other than a rectangular form or the thickness of the wiring substrate 10 is not constant, the IC chip 20 is adhered to the wiring substrate 10 with an ACP (Anisotropic Conductive Paste) 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
