发明名称 |
SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SAME, MILLIMETER-WAVE DIELECTRIC TRANSMISSION DEVICE, METHOD FOR PRODUCING SAME, AND MILLIMETER-WAVE DIELECTRIC TRANSMISSION SYSTEM |
摘要 |
<P>PROBLEM TO BE SOLVED: To structure a millimeter-wave dielectric transmission system which can be easily configured without using a connector having a number of terminals and a wiring cable having a large mounting area. <P>SOLUTION: The millimeter-wave dielectric transmission system is comprised of: semiconductor chips 30 which enable millimeter-wave communication and are provided on one of interposer substrates 4; antenna structures 32 connected thereto; two semiconductor packages 20a, 20b having molded resins 8 covered by the semiconductor chips 30 and the antenna structures 32; and a dielectric transmission line 21 which is provided between the two semiconductor packages 20a, 20b and can transmit millimeter-wave signals. The semiconductor packages 20a, 20b are mounted so that the antenna structures 32 hold the dielectric transmission line 21 therebetween. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010183055(A) |
申请公布日期 |
2010.08.19 |
申请号 |
JP20090164506 |
申请日期 |
2009.07.13 |
申请人 |
SONY CORP |
发明人 |
KAWAMURA TAKUSHI;OKADA YASUHIRO |
分类号 |
H01L23/12;H01L25/10;H01L25/11;H01L25/18;H01P5/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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