| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the molding quality of a workpiece having a thin resin thickness and a wide resin sealing area and to provide a compression molding method easy of sheet resin handling. <P>SOLUTION: In the compression molding method, a sealing resin 12 is supplied on a mount 11 in a first mold and heated at a first temperature lower than a molding temperature by clamping to form the semi-cured sheet resin 14 with the mount, and the sheet resin 14 with the mount is taken out of the first mold and quenched to the vicinity of room temperature while being pressed by a surface plate 15 for cooling. The sheet resin 14 with the mount is carried into a second mold Q, clamped with the workpiece 20, and cured by being heated and pressurized at a second temperature higher than the first temperature to carry out compression molding. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
