| 摘要 |
The present invention is a method of manufacturing miniaturized organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices that have a 50% reduction in physical dimensions with respect to prior art existing organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices. The base planar substrate has a vapor deposited 0.02 mil thick copper cladding thereon its first planar surface that has been affixed atop a hydrophillic layer, and an adhesive layer on its second planar surface. The copper cladding has sufficient peel strength and a low enough etch factor so as to allow 10 micron (or smaller) electrical trace pathways to be formed thereon when the steps of a specifically designed manufacturing methodology are followed.
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