POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM USING SAME, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

摘要

Disclosed is a positive photosensitive resin composition which can reduce warping of a substrate such as a semiconductor wafer even when the positive photosensitive resin composition is subjected to dehydration ring closing by the application of a thermal history, said positive photosensitive resin composition containing a polyamide resin that is mainly composed of a polybenzoxazole precursor, and being patterned on the substrate such as a semiconductor wafer by coating, exposure and development.  Also disclosed are: a cured film which is obtained by subjecting the positive photosensitive resin composition, which contains a polyamide resin that is mainly composed of a polybenzoxazole precursor, to dehydration ring closing; a protective film comprising the cured film; an insulating film; a semiconductor device; and a display device.  Specifically disclosed is a positive photosensitive resin composition containing a polyamide resin (A) and a sensitizing agent (B), wherein the polyamide resin comprises a repeating unit (A-1) represented by general formula (1), and a repeating unit (A-2) represented by general formula (2) and/or a repeating unit (A-2) represented by general formula (3).